Semiconductor & Electronic Adhesives
Semiconductor & Electronic Adhesives
Vitrochem Technology is honored to be in partnership with some of the most prominent adhesive specialty companies like AI Technology, Everwide Chemical, Timtronics and Vitrobond to provide and support the Semiconductor & Electronics industries with the extensive range of specialised adhesives systems for the electronics package and assembly purpose. The types of products being offered to this industry range from Die Attach, Dam & Fill, Glop Top Encapsulant (COB), Underfills, Surface Mount Adhesives and many related electronic grade adhesives being used in this specialised field.
Technical Literature
- Underfill Epoxy
- Glob Top (COB) Encapsulation
- Underfill and Glob-Top Encapsulation
- Die Attach & TIM’s for CPU
- Substrate and Component Attach
- Flip-Chip and BGA Underfills
- Die Attach Adhesives
Die Attach Adhesives
Die Attach Paste Adhesives
AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.
| AIT Part No | Characteristics | Electrical Resistivity (Ohm-cm) | Thermal Conductivity (Watt M-0C) | Die-Shear (PSI) | TG (°C) | Viscosity / Thixotropic Index |
|---|---|---|---|---|---|---|
| EG8020 |
|
<4x10-4 | >5.7 | >1,800 | 50 | 150,000(cps@ 0.5 rpm) |
| EG8050-LV |
|
<4x10-4 | >7.9 | >1,500 | -20 | 129,000(cps@ 0.5 rpm) |
| EG8050 |
|
<4x10-4 | >7.9 | >2,000 | -20 | 190,000(cps@ 0.5 rpm) |
| ME8155 |
|
<4x10-4 | >7.9 | >2,000 | -20 | 354,000(cps@ 0.5 rpm) |
| ME8452-A |
|
<4x10-4 | >7.9 | >2,000 | -20 | 255,000(cps@ 0.5 rpm) |
| ME8456 |
|
<4x10-4 | >7.9 | >1,000 | -20 | 130,000(cps@ 0.5 rpm) |
| ME8456-00 |
|
<4x10-4 | >12.5 | >1,200 | -20 | 60,000(cps@ 0.5 rpm) |
| ME8512 |
|
<4x10-4 | >7.9 | >1,200 | 50 | 15,000(cps@ 0.5 rpm) |
| ME8550-DA |
|
<1x10-3 | >7.9 | >1,000 | -55 | 40,000(cps@ 5 rpm) |
| ME8630-DA |
|
<4x10-4 | >8.6 | >2,400 | 80 | 8,000(cps@ 5 rpm) TI >4.0 |
| ME8630-RC |
|
<5x10-4 | >8.6 | >2,400 | 80 | 15,000(cps@ 5 rpm) TI >4.0 |
| ME8650-DA |
|
<4x10-4 | >3.6 | >1,900 | -40 | 8,000(cps@ 5 rpm) TI >4.0 |
| ME8650-RC |
|
<5x10-4 | >7.9 | >1,500 | -20/-50 Minor | 18,000(cps@ 5 rpm) TI >4.0 |
| ME8850-DA |
|
<5x10-4 | >7.9 | >1,000 | -20/-50 minor | 10,000(cps@ 5 rpm) |
| MC8880 |
|
<5x10-2 | >9 | >2,500 | 240 | 65,000(cps@ 5 rpm) |
| Vitrobond AG806-2 |
|
0.0005 | 60 BTU/in | 2400 | 70 | 30,000 – 40,000 |
Die Attach Film Adhesives
DAF (Die Attach Film) and DDAF (Dicing Die Attach Film) Adhesives
PROVEN RELIABILITY
Die-Attach film (DAF) adhesive has become popular and mandatory when stack chips are used to accomplish larger capacity in 3-D packaging of flash memory devices. The push now is for an even thinner insulating die-attach adhesive that can properly handle interfacial stresses in stacking chips with bond-lines as thin as 8-10 microns or less to help mobile devices to achieve even lower profiles.
In addition to offering a thinner bond-line for stacked chip devices, film adhesives that are properly engineered for die-attach provide several advantages over traditional paste adhesives for almost all semi-conductor devices:
- By eliminating the paste dispensing requirement of low viscosity, AIT produces DAF film adhesives with proper melt-flow and bonding characteristics with engineered molecular structures to manage stress, thermal stability and moisture absorption and sensitivity with unparalleled performance
- By laminating the DAF film adhesives with controlled thicknesses from 10 microns, AIT DAF adhesives melt-flow at temperatures around 80°C and are thus ambient storable for shipping and handling for one year at ambient temperature before or after dicing
- AIT is also one of the first to provide proven DAF adhesives that are electrically conductive for power devices in the thickness of 20 microns
- AIT is also one of the first to provide thermally conductive DAF adhesives that are electrically insulating but thermally conductive with years of proven success manufacturing thicknesses of 20 microns.
- AIT DAF is also engineered to melt-flow and bond onto substrates at a temperature of 125-175°C with minimal pressure of around 5 psi and continue for full cure at the same temperature without applying pressure. Unlike paste, the die position will not shift, thus allowing ultra-precise packaging needed in multi-chip modules (MCM) or SiP (System-in-package).
In addition to offering a DAF adhesive with unparalleled performance in managing interfacial stresses even at low bond-line thicknesses, ultra-low moisture-temperature sensitivity, and thermal stability, all with high enough glass transition temperature of 175°C and beyond in enabling high productivity of wire-bonding up to 250°C, AIT DAF adhesives also feature more common properties used in worldwide production:
- RoHS and REACH compliant
- Availability of width for 450mm and beyond for all thicknesses from 10-micron thickness and with option for pre-laminated onto dicing tape (DDAF) with standard, UV, and/or thermal releases
- Manufactured in a clean room environment with a scalable capacity of more than 10 million square ft per year in the United States.
| AIT Part No | Characteristics | Electrical Resistivity (Ohm-cm) | Thermal Conductivity (Watt M-°C) | Die-Shear (PSI) | TG (°C) | Film Thickness |
|---|---|---|---|---|---|---|
| ESP7660-HK-DAF |
|
>1×1014 | >0.8 | >4,000 | 175 | 10 µ20 µ40 µ |
| ESP7666-HK-DAF |
|
>1×1014 | >1.8 | >2,000 | 175 | 20 µ40 µ |
| ESP8660-HK-DAF |
|
<4x10-4 | >8.0 | >3,000 | 175 | 20 µ40 µ |
| ESP8450-DAF |
|
<4x10 -4 | >8.0 | >2,000 | 90/-50 | 20 µ40 µ |
One Component Heat Cure Epoxy
Glob Top Epoxy Encapsulant
Vitrochem Technology has been in the forefront of producing an extensive range of high performance 1 component heat-curable epoxy compound mainly used in the electronic industry for Glob Top (COB), Die Attach, Chips Bonding and Ferrite Bonding applications. These epoxies have been designed to meet the industry standard requirements for its mechanical, electrical, thermal and reliability performances. We can custom build new epoxy formulation and has the ability to turn around the time to market time to meet the growing demands for electronics grade epoxies.
| Product No | Characteristics | Application | Viscosity (cps @ 25°C) | Cure Profile |
|---|---|---|---|---|
| Vitrobond EC 108 |
|
Glob Top | 150’000 | 130°C @ 1 Hour |
| Vitrobond EC 1002 |
|
Glob Top | 70’000 – 90’000 | 90°C @ 30 Minutes |
| Vitrobond EC 5640 |
|
Glob Top Potting & Encapsulation |
42’000 – 65’000 | 100°C @ 30 Minutes 80°C @ 60 Minutes |
| Vitrobond VC 108-1 |
|
Glob Top | 72’000 – 95’000 | 100°C @ 5 Hours |
| Vitrobond EN 484 |
|
|
Thixotropic | 100°C @ 3 Hours |
| Vitrobond EN 640-T5 |
|
Glob Top | 72’000 | 130°C @ 2 Hours |
Heat Cure Bonding Epoxy
One component heat cure epoxy is a premixed adhesive that has been integrated with the base epoxy resin and hardener into a single system. It takes away the measurement and mixing process that comes along with two components system. The epoxy can be used after it has been thawed from cold storage and the curing profile and time taken varies between the formulation epoxies. These epoxies are designed with different viscosities, glass transition, cure condition and specific functions to serve the applications.
| Product No | Characteristics | Application | Viscosity (cps @ 25°C) | Cure Profile |
|---|---|---|---|---|
| Vitrobond HEM 495 |
|
Encapsulation Casting & Potting |
40’000 | 130°C @ 1 Hour |
| Vitrobond HEM 405 |
|
Potting Sealing |
22’000 | 100°C @ 40 Minutes |
| Vitrobond JD 322 |
|
Bonding components Sealing |
128’000 – 195’000 | 100°C @ 30 Minutes Or 80°C @ 60 Minutes |
| Vitrobond EC 401 |
|
Bonding Sealing |
48’000 – 50’000 | 140°C @ 30 Minutes |
| EW JC 349-4 |
|
Bonding Sealing |
71’000 – 82’000 | 140°C @ 40 Minutes |
| EW JC 564-34 |
|
Bonding Sealing Encapsulation |
25’000 – 60’000 | 100°C @ 60 Minutes |
| EW JC 564-65 |
|
Bonding Sealing Encapsulation |
42’000 – 65’000 | 80°C @ 60 Minutes |
| EW JD 380-8 |
|
Bonding Sealing |
241’000 – 363’000 | 150°C @ 60 Minutes |
| EW JD 661 |
|
Bonding Sealing |
15’000 – 23’000 | 60°C @ 60 Minutes |
Surface Mount Epoxy
In the fast placement process of Surface Mount Technology, epoxy with high green strength is used to prevent the SMT components from skewing during and after reflow. SMT epoxies are used to bond components on the PCB during wave soldering reflow. The green strength from these epoxies enable it to hold Surface Mount Devices (SMD) from skewing during high speed processing and complete reflow soldering process. The range of SMT epoxies is able to meet the standard specifications required by the PCB assembly industry.
| AIT Part No | Characteristics | Application | Viscosity (cps @ 25°C) | Cure Profile |
|---|---|---|---|---|
| EW JC 711-13 |
|
Surface Mount Adhesive | 80’000 – 150’000 |
|
| EW JC 711-19 |
|
Surface Mount Adhesive | 52’800 |
|
Underfill Epoxy
In any flip-chip packaging, the Thermal Coefficient of Expansion (CTE) between the solder ball, silicon die and the bonding substrates vary differently. The CTE mismatch strain will occur greatly if the silicone die is larger in dimension. If such mismatched between the substrates is not addressed, it will cause failure to the flip-chip package. To address it, a liquid underfills encapsulant like epoxy resin with a CTE that is close to solder bumps is filled into the gap or cavity between the silicon die and substrate. With this underfill process, it will enable the stronger adhesion between the silicon die and substrate and at reducing the stress and possible strains on the soldering joints.
New Generation of Ultra High Tg Underfill
(with Glass Transition of Over 240°C for Ultimate Flip-Chip and Component Stress Management)
Liquid Underfills with Ultra-high Glass Transition (Tg):
- Balancing these modified cyanate ester underfills that cure to much higher glass transition temperatures and the stress absorption.
- Outstanding thermal conductivity and low thermal resistance afford better thermal dissipation from powerful chip to both side of the microelectronic package.
- Proven in use for the most stringent military applications
High Melt-Flow Film Underfill for FOW:
- Outstanding melt-flow and wetting to flow-over-wire for stack-chip applications
- Ability to cure at lower temperature from 100-150°C for lower interfacial stresses
- Ideal for large area stack-chip and module
- Preform with specific thickness accommodates the flip-chip or ball-grid-array parts with preformed cut-outs for interconnections allowing the film adhesive to flow and encapsulate for protection
| Product No | Characteristics | Application | Viscosity (cps @ 25°C) | Cure Profile |
|---|---|---|---|---|
| EW JC 823-3 |
|
BGA & CSP Underfill | 550 – 850 |
|
| EW JC 823-6 |
|
BGA & CSP Underfill | 2’500 – 4’000 |
|
| EW JD100-1 |
|
BGA & Flip Chip | <20’000 |
|
Underfill Liquids and Film Adhesives:
| FUNCTION | AIT PART# | THERMAL, ELECTRICAL, & other RELEVANT PROPERTIES |
|---|---|---|
| Stress and Thermal Management | MC7866-UF |
|
| Stress and Thermal Management | MC7863-UF |
|
| Stress Management | MC7686-UF |
|
| Flow-Over-Wire Underfill Film Adhesive | ESP7660-FOW |
|
| Flow-Over-Wire Underfill Film Adhesive | CXP7860-FOW |
|
| Preform Underfill for Thermal and Stress Management | CXP7686-UF |
|
| Preform Underfill for Thermal and Stress Management | ESP7666-FOW |
|